A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/10fffc6d-82f9-45e9-b5c9-3e132e118498
“Power consumption is at the heart of every decision we made for our new applications processor design, which now makes it possible to achieve stunning visual displays and ultra-low power standby modes in a single processor,” said Joe Yu, vice president of low power MPUs at NXP. “From the selection of the FD-SOI process and dual GPU architecture, to the heterogeneous processor architecture with independent power domains, every aspect of our new processor design is aimed at providing the best performance and user experience with unprecedented energy efficiency.”
The design’s extreme low leakage and operating voltage (Vdd) scalability is attained through reverse and forward body biasing (RBB/FBB) of the transistors and its smart power system architecture. This high performance, low power solution is optimized for customers developing IoT, home control, wearables and other applications that spend a significant amount of time in standby mode with short bursts of performance-intense activity that require exceptional graphics processing.
NXP’s unique FD-SOI design enables:
“We are excited that NXP is the first to bring the benefits of FD-SOI (28FDS) technology to the general purpose market,” said Ryan Lee, VP of the Foundry Marketing Team at
NXP’s processor design enables robust low power graphics for the IoT and Wearable markets through two graphic processor units (GPU) from Vivante--the GC7000 NanoUltra 3D GPU with a low power single shader, and the GC320 Composition Processing Core (CPC) for 2D graphics. The 3D GPU plays a critical role in enabling rich 3D based user interfaces, while the CPC can accelerate both rich 3D and simpler 2D user interfaces. Processors based on the combination of the two GPUs enable efficient display systems which offload and significantly reduce system resources, in turn providing rich user interfaces at low power levels to extend the battery life of devices.
“Our 3D GPU is a result of a joint collaboration between Vivante and NXP to deliver industry-leading 3D capabilities with the lowest power consumption,” said Wei-Jin Dai CEO at
The i.MX 7ULP applications processor family is currently sampling to select customers. Broader availability of pre-production samples is scheduled for Q3 2017.
See NXP Technologies in Action at Embedded World 2017 in Nuremberg, Germany
Visit NXP during Embedded World in Hall 4A – 220 at the Exhibition Centre Nuremberg. See the new i.MX 7ULP applications processor in action and interact with other innovative demonstrations for embedded solutions enabling the IoT from smart cars to smart industry.
For more information about NXP news at Embedded World, please visit www.nxp.com/EW17/mediacenter.
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For more information, please contact: Americas Tate Tran Tel: +1 408-802-0602 Email:firstname.lastname@example.org Europe Martijn van der Linden Tel: +31 6 10914896 Email: email@example.com Greater China / Asia Esther Chang Tel: +886 2 8170 9990 Email: firstname.lastname@example.org
March 13, 2017 at 2:00 AM EDT
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