Press Release

NXP Launches Multi-Standard Programmable Family of System on Chip Solutions
The New Layerscape SoC family delivers flexible and simultaneous support for 5G, Wi-Fi and Wireline Systems on a single architecture for enterprise, home and Carrier applications

BARCELONA, Spain, Feb. 22, 2017 (GLOBE NEWSWIRE) -- NXP Semiconductors™ N.V. (NASDAQ:NXPI), a worldwide leader in advanced secure connectivity solutions, today announced a new family of fully programmable, multi-standard SoCs for multi-access technologies including 5G evolution. The Layerscape Access family targets scalable solutions in wired and wireless enterprise and carrier networks, and home gateway markets. The family enables rapid deployment of next generation platforms into these markets with fully programmable technology.

The first product in the family, the LA1575, solves a multi-standard problem with simultaneous implementation of 802.11ax, 802.11ad, and millimeter wave (mmWave) standards on a single SoC device. Initial targets include enterprise and high-end home gateway markets. The LA1575 integrates a fully programmable PHY and MAC with acceleration technologies for 5G, Wi-Fi and wireline protocols that allow updates, changes, and new features to be added via simple software upgrades.

OEMs can be first to market with the LA1575 using the pre-ratified version of standards while ensuring the ability to update their end products quickly via software to final release versions with differentiated features.

“A fully programmable PHY and MAC is game-changing technology that will fundamentally impact the way new standards are implemented,” said Tareq Bustami, senior vice president and general manager at NXP Semiconductors. “Ultimately, we will enable solution providers to deploy fully programmable systems capable of connecting clients at the speeds they expect over virtually any access technology. Early customer engagements on the LA1575 validate the benefits of our overall solution.”

“Extending NXP’s 64-bit ARM® portfolio by including physical- and MAC-layer processing, the LA1575 builds upon the company’s deep experience in processing, wireless technologies, and networking infrastructure,” said Jag Bolaria, principal analyst for embedded at The Linley Group. “This new offering reinforces NXP’s position as a leading supplier of one of the broadest portfolios of ARM 64-bit networking solutions.”

The LA1575 provides the optimum balance of programmable acceleration with dynamic PHY and MAC resource allocation across protocols in systems complying with power over Ethernet solution requirements. It builds on the joint technology announcement and demonstration at Mobile World Congress 2016.

Key elements of the LA1575 SoC:

  • Simultaneous multi-standard support for 5G, Wi-Fi (802.11 ac and 802.11ax) and Wireline systems
  • Dynamic PHY and MAC resource allocation at run-time across protocols
  • Rapid deployment of evolving standards for mmWave, 802.11ax, 802.11ad and wireline
  • Comparable performance and efficiency to hard-wired solutions
  • Full software implementation allowing customer-differentiated feature sets and flexibility
  • Leverages extensive third party ecosystem providers and the rich library base for Layerscape and ARM 64-bit cores
  • Powered by the latest acceleration and secure platform technologies, packet offload and physical layer processing
  • Samples available April 2017

Attendees and media are invited to experience a demonstration under NDA at the NXP Mobile World Congress 2017 booth #7E30, Fira Grand via, Barcelona, Spain.

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 31,000 employees in more than 33 countries and posted revenue of $9.5 billion in 2016. Find out more at www.nxp.com.

NXP the NXP logo and Layerscape are trademarks of NXP B.V. All other product or service names are the property of their respective owners. ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. All rights reserved. © 2017 NXP B.V.

For more information, please contact:

Americas
Jacey Zuniga
Tel: +1 512-895-7398
Email: jacey.zuniga@nxp.com

Europe
Martijn van der Linden
Tel: +31 6 10914896
Email: martijn.van.der.linden@nxp.com

Greater China / Asia
Esther Chang
Tel: +886 2 8170 9990
Email: esther.chang@nxp.com

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NXP Semiconductors Netherlands B.V.

Published

February 22, 2017
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