The initial phase of the joint project will focus on the development of a full digital cockpit solution, based on the NXP i.MX 8 QuadMax. The platform will include digital clusters, and a head-up display (HUD) system, which will enable leading global automotive OEMs and Tier Ones to deliver vivid in-vehicle experiences for their customers. The digital cockpit solution is expected to start mass production in 2023. The companies aim to expand the relationship into UWB-based secure car access, and safe automated driving, augmented by NXP’s leading radar solutions.
“FII is committed to providing clients with an automated, connected platform and big data-based technology, services and solutions, in order to create application platforms across cloud computing, mobile devices, Internet of Things (IoT), artificial intelligence (AI), smart networks, robotics and automation, among other industries,” said Brand Cheng, CEO at Foxconn Industrial Internet Co. Ltd. “We believe that EVs and emerging technology innovation are derived from computing power, system integration, and energy management. We are pleased to join forces with NXP to strengthen the development blueprint of FII and drive innovation for connected cars by leveraging NXP’s leading automotive technology.”
“As a leading global automotive semiconductor supplier, NXP has combined its strong heritage in safety, security and quality with innovation across the vehicle’s domains,” said
About Foxconn Industrial Internet
Foxconn Industrial Internet (Fii) is a world's leading provider of intelligent manufacturing integration solutions. It has been listed on A shares in June, 2018 (Stock code: 601138).Fii aims to provide enterprises with comprehensive solutions for technology services based on automation, network and platform, leading the transformation from traditional manufacturing to intelligent manufacturing.
Fii has been building a cross-industry industrial Internet application platform driven by cloud computing, mobile terminals, Internet of Things (IoT), big data, artificial intelligence, high-speed network and robot, thus forming a integrated technology empowerment ecosystem. Find out more at https://www.fii-foxconn.com/#/
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Source: NXP Semiconductors N.V.