Building upon multiple successful 16nm designs, TSMC and NXP are expanding their collaboration to create a System-on-Chip (SoC) platform in 5nm to deliver the next generation of automotive processors. Using TSMC’s 5nm process, NXP’s offerings will address a wide variety of functions and workloads, such as connected cockpits, high-performance domain controllers, autonomous driving, advanced networking, hybrid propulsion control and integrated chassis management.
TSMC’s 5nm technology is currently the world’s most advanced process in volume production. NXP will adopt N5P, an enhanced version of TSMC’s 5nm technology, which provides about 20 percent faster speed or about 40 percent power reduction compared to the preceding 7nm generation, and is supported by the industry’s most comprehensive design ecosystem.
NXP is a leading global automotive supplier with a rich history in vehicle control, vehicle safety, vehicle infotainment and digital clusters. NXP’s developments on 5nm, initially based on its established S32 architecture, will lead to new architectures offering scalability and a common software environment, further simplifying and enabling the significant increase in software performance required in the future car. Leveraging the computing power and power efficiency of the 5nm technology, NXP will meet the high levels of integration, power management and compute power required for advanced vehicle architectures as well as their stringent safety and security needs with its renowned IP.
“Modern vehicle architectures need to harmonize software infrastructure across domains to leverage investments, scale deployments and share resources,” said
“TSMC’s latest collaboration with NXP truly demonstrates how automotive semiconductors have evolved from simple microcontrollers to sophisticated processors on par with chips used in the most demanding high-performance computing systems,” said Dr.
NXP and TSMC expect the delivery of first samples of 5nm devices to NXP’s key customers in 2021.
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TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s largest dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning
TSMC deployed 272 distinct process technologies, and manufactured 10,761 products for 499 customers in 2019 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu,
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Source: NXP USA, Inc.